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Data SheetsAluminumAl, 99.999% pure, Sputtering TargetsScope:This product data sheet characterizes Fine Grain Process Aluminum sputtering targets sold by SCI Engineered Materials (SCI). The following information is not a specification; however, it may prove useful to the customer in developing a formal product specification. General Description:SCIs Fine Grain Process Aluminum sputtering targets can be produced in various sizes and shapes. Their microstructural uniformity and fine grain consistency produce excellent results in most thin film applications. Custom dopants can be added and higher purities are available upon request. Bonding:Fine Grain Process Aluminum sputtering targets produced by SCI can be bonded to customer supplied backing plates. SCI also supplies backing plates upon request. SCI provides several bonding processes to ensure adequate mechanical strength, thermal transfer, and superior electrical conductivity. Cleaning & Packaging:A high purity solvent is used to clean and rinse the targets. The entire target assembly is sealed in vacuum poly bags and securely packed into SCI or customer supplied shipping containers. Documentation:A Certificate of Analysis and Material Safety Data Sheet and are included with each target. |
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